lyg3392/r1-pf dual color led lamps ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905- rev. : a date : - 2006 23 - aug. lyg3392/r1-pf lead-free parts pb
ligitek electronics co.,ltd. property of ligitek only 1/6 page y g 7.6 8.6 10.5 0.5 5.0 5.9 package dimensions lyg3392/r1-pf part no. 1.5max - + - 1 23 3.cathode yellow 1.cathode green 2.common anode 2.0min 2.54typ 0 60 30 75%100% 25% 25%0 50% directivity radiation -60 -30 75% 100% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 2.54typ 0.5 typ 2.0min 1 2 3 50% 18.0min
tstg storage temperature -40 ~ +100 forward voltage @20ma(v) 1.7 1.7 min. note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) spectral halfwidth nm peak wave length pnm material part no yellow green emitted lyg3392/r1-pf gap gaasp/gap white diffused lens 56530 58535 color viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) 1.8 1.8 typ. 2.6 1.2 2.6 max. 1.2 min. 76 76 -40 ~ +85 ratings ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 forward current operating temperature reverse current @5v power dissipation peak forward current duty 1/10@10khz parameter 20 i f t opr ir pd i fp 10 80 60 symbol y page 2/6 ma 30 10 100 120 a ma mw g unit lyg3392/r1-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip 3/6 page lyg3392/r1-pf part no.
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -40 60 ambient temperature( ) 40 20 0 -20100 80 0.0 ambient temperature( ) 02040 -20 60100 80 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 1.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 10 1.0 1000 g chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 0.5 4.0 forward voltage(v) 2.03.05.0 0.0 1.5 1.0 2.0 100 forward current(ma) 101000 fig.2 relative intensity vs. forward current 2.5 3.0 ligitek electronics co.,ltd. property of ligitek only 3.5 page 4/6 lyg3392/r1-pf part no.
page 5/6 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile temp( c) 260 c3sec max 5 /sec max 260 150 time(sec) 100 50 25 0 0 2 /sec max preheat 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max lyg3392/r1-pf part no.
ligitek electronics co.,ltd. property of ligitek only reference standard description mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: test item high temperature storage test low temperature storage test operating life test test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. high temperature high humidity test solder resistance test thermal shock test solderability test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec page 6/6 lyg3392/r1-pf part no.
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